Name: GIGABYTE B850 Eagle WIFI6E AMD Motherboard
SKU: LZ8481868439
Availability: InStock

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Features of GIGABYTE B850 Eagle WIFI6E AMD Motherboard

X3D Turbo Mode

Unleash New Era Gaming Performance with One-Click Activation.

X3D Turbo Mode’s unique optimization parameters allow even Ryzen 9000 X3D gaming Performance enhance & Ryzen 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency with GIGABYTE’s BIOS innovation- X3D Turbo Mode.

One-Click Acceleration :

Enhance Gaming FPS Performance with a single click.

Auto CPU & DDR5 Memory Boost

With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.

One-Click Acceleration:

Enhance CPU & DDR5 speeds with a single click.

Real time Analyze
OC accuracy UP
EZ to Pro

Fast AI Performance

Accelerate AI processing for greater performance

Up to

AI Performance*

Accelerated AI decision-making
Boosted reinforcement learning
Streamlined language processing

Boost CPU & Memory Performance

Raise system speed and performance.

Up to

CPU & Memory Performance Boost

Tailored-overclocking for your CPU and memory
Faster data transfer and application loading
Improved multitasking performance
Optimized overall system performance

Maximize performance in a snap

Enable users to easily become overclocking experts through a simple interface.

AI-Driven PCB Technology-Redefining PCB Design with Artificial Intelligence

AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.

AI-ViaFusion Technology
Optimized vias & pads for signal integrity
AI-Trace Technology
Smart routing for peak performance
AI-Layer Technology
Tailored stackups for enhanced functionality

Key Features:
AI-Generated Design Recipes
AI-Driven Simulation
AI-Powered Signal Verification
Single and cross-layer signal optimization

AI-ViaFusion Technology – AI-Powered Excellence in Signal Integrity

Reduction in Signal Reflection Up to28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.

Best-in-class Signal Quality

Superior signal transmission efficiency
Dramatically reduced signal reflection
Elevated signal quality and reliability
Enhanced cross-layer PCB signal performance

AI-ViaFusion Technology – AI-Engineered Via Design Formula

AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.

Optimized Via Design
Varied via sizes for optimized signal and power paths
Driven Pad Optimization
Custom pad sizes for performance and production balance
Precision Impedance Matching
Via & pad sizes selected for optimal signal impedance

Unlock AI-Powered Performance with AI-ViaFusion Technology

Minimized Insertion Loss
Optimized vias reduce signal loss
Enhanced Return Loss
Precision impedance matching reduces reflections
Optimized Eye Diagram
Wider eye opening improves signal integrity

AI-ViaFusion Technology – AI-Driven Revolution in PCB Design

Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.

AI-ViaFusion Technology optimizes PCB performance through:

Strategic Via Sizing
Optimized for varied signals across PCB
Enhanced Impedance Matching
Precise control via machine learning
Space Optimization
Maximized layout efficiency with signal integrity

AI-Trace Technology-Revolutionizing PCB Routing with AI

AI-Trace Technology transforms PCB design by leveraging AI to optimize trace routing, resulting in enhanced performance and signal integrity.

Fiber Weave Effect Mitigation
Optimized signal synchronization
Shielded Memory Routing
Optimized signal shielding and precision
Impedance-Optimized Topology
Refined traces with minimal resistance
Isolated Memory Routing
Optimized trace layout and layer separation
Daisy-Chained Routing
Innovative design eliminates signal bottlenecks

Mitigating Fiber Weave Effect with AI-Trace Technology

Fiber Weave Effect in high-speed PCBs stems from varying dielectric constants of epoxy resin and glass fibers, this causes varying signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace Technology implements innovative routing angles to mitigate this effect.

Benefits of Mitigation:

Reduces signal distortion
Improves transmission reliability
Supports higher data rates
Enhances overall system stability

AI-Layer Technology -Next-Generation Multi-Layer PCB Design

AI-Layer Technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.

Core Innovation: AI-Optimized Layer Customized Design

AI-optimized layer design
Unique material for each layer
AI-verified signal integrity
Tailored PCB for peak performance

Infinite Memory Performance

EAGLE motherboards boost DDR5 memory performance and offer top-notch compatibility using various advanced methods.

4Xlarger surface area for enhanced heat dissipation

With up to 4 times the surface area of traditional coolers, this advanced design significantly boosts MOSFET cooling performance.

5 W/mKthermal pad for efficient thermal conductivity

High-performance thermal pad
Keeps your system cool and running at peak efficiency

Multi-cut design with channels for improved airflow

More grooves, more airflow.
Better airflow, cooler system.

True one-piece heatsink design

Outperforms competitors’ multi-piece solutions
Integrated design and expanded surface area deliver exceptional cooling performance

Smart Fan 6

Superior cooling performance and whisper-quiet operation for your gaming rig.

High Current Support

Supports both PWM and DC fans, plus water cooling pumps
Up to 24W (12V x 2A) capacity per fan header
Built-in over-current protection

Precision Control

Multiple temperature and fan speed points
Customizable fan curves for optimal performance

Dual Curve Mode

Choose between slope and stair modes
Tailor cooling to your specific needs and preferences

Fan Stop Technology

Fans can be completely turned off at low temperatures
Ensures silent operation during light loads

Enhance Fan Curve UI

7 adjustable control points
Expanded speed graph for precise adjustments

Slope/Stair Dual Graph Mode

Slope mode: Smooth fan speed curve
Stair mode: Steady speeds within temperature ranges
Easy switching between modes

Manual Input

Fine-tune fan speeds for optimal performance
Precise control for enthusiasts

EZ Tuning

Quick setup with 4 temperature and fan speed points
Automatic optimization of fan curve

Fan Curve Profile

Save personalized settings to BIOS ROM
Maintain custom settings through BIOS updates

EZ Debug Zone

Centralized debug LEDs and control buttons provide a handy and organized troubleshooting process when building a new computer.

Multi-key

A flexible control key for reset with BIOS-level reconfiguration options for diverse usage scenarios.

RGB Switch

Disable all light displays on the motherboard.

Direct-To-BIOS

Access the BIOS settings directly without keyboard inputs.

Safe Mode

Access BIOS safe mode to modify select settings while preserving other configurations.

Born from Ultra Durable

Technology embodies our commitment to excellence, providing gamers with a platform that’s not only powerful but also built for longevity and reliability. GAMING series motherboards are engineered to endure and excel.

Multi-Theme

Now users can choose different BIOS themes with one simple click It not only delivers an immersive user experience but also offers a brand new user-friendly theme: Grayscale.

AIO Fan Control

Enable non-windows users to adjust AIO fan speed in the BIOS before entering the OS.

Refined BIOS Interface

GIGABYTE User-Centred (UC) BIOS elevates the interface, delivering an optimized experience through an easy-to-navigate layout and attractive design for optimal usability.

Quick Access Function

GIGABYTE UC BIOS’ Quick Access function selects brings 9 key options from Advanced Mode directly into Easy Mode, enabling swift adjustments without extensive navigation.

AORUS & HWiNFO Co-branded OSD

AORUS and HWiNFO co-branded OSD(On-Screen Display) can display values as text or graphs in an overlay or independent window, also in full-screen applications and games, with no need for additional software installation.

Default AORUS skin

When using HWiNFO on a GIGABYTE motherboard, a custom AORUS-themed interface automatically activates, offering light and dark options. This AORUS Skin can be manually applied to non-GIGABYTE boards as well.

Specifications of GIGABYTE B850 Eagle WIFI6E AMD Motherboard

CPU	AMD Socket AM5, support for: AMD Ryzen 9000 Series Processors/ AMD Ryzen 8000 Series Processors/ AMD Ryzen 7000 Series Processors (Go to GIGABYTE’s website for the latest CPU support list.)
Chipset	AMD B850
Memory	Support for DDR5 8200(O.C) / 8000(O.C) / 7950(O.C) / 7900(O.C) / 7800(O.C) / 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C) / 6200(O.C) / 6000(O.C) / 5800(O.C) / 5600(O.C) / 5200 / 4800 / 4400 MT/s memory modules. 4 x DDR5 DIMM sockets supporting up to 256 GB (64 GB single DIMM capacity) of system memory Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO) and Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” on GIGABYTE’s website for more information.)
Onboard Graphics	Integrated Graphics Processor with AMD Radeon Graphics support: – 1 x DisplayPort, supporting a maximum resolution of 3840×2160@144 Hz * Support for DisplayPort 1.4 version and HDR. – 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz * Support for HDMI 2.1 version, HDCP 2.3, and HDR. ** Support for native HDMI 2.1 TMDS compatible ports. (Graphics specifications may vary depending on CPU support.)
Audio	Realtek Audio CODEC High Definition Audio 2/4/5.1/7.1-channel
LAN	Realtek GbE LAN chip (1 Gbps/100 Mbps/10 Mbps)
Wireless Communication module	Intel Wi-Fi 6E AX210 (PCB rev. 1.0) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3 – Support for 11ax 160MHz wireless standard Realtek Wi-Fi 6E RTL8852CE (PCB rev. 1.1) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3 – Support for 11ax 160MHz wireless standard (Actual data rate may vary depending on environment and equipment.)
Expansion Slots	1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x16 mode AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode * The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot. Chipset: – 3 x PCI Express x16 slots, supporting PCIe 3.0 and running at x1 (PCIEX1_1, PCIEX1_2, PCIEX1_3)
Storage Interface	1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs: AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs 1 x M.2 connector (M2B_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs: AMD Ryzen 9000/7000 Series Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x2 SSDs 1 x M.2 connector (M2C_SB), integrated in the Chipset, supporting Socket 3, M key, type 22110/2280 PCIe 4.0 x2 SSDs 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices * RAID 5 is only available on AMD Ryzen 9000 Series Processors. RAID 0, RAID 1, and RAID 10 support for SATA storage devices
USB	CPU: – 1 x USB Type-C port on the back panel, with USB 3.2 Gen 1 support – 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel Chipset: – 1 x USB Type-C port with USB 3.2 Gen 1 support, available through the internal USB header – 4 x USB 3.2 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header) – 4 x USB 2.0/1.1 ports on the back panel Chipset+USB 2.0 Hub: – 4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors	1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x 4-pin ATX 12V power connector 1 x CPU fan header 1 x CPU fan/water cooling pump header 3 x system fan headers 1 x system fan/water cooling pump header 3 x addressable RGB Gen2 LED strip headers 1 x RGB LED strip header 3 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 1 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only) 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper

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GIGABYTE B850 Eagle WIFI6E AMD Motherboard