Name: GIGABYTE B850M Aorus Elite Wifi6E ICE DDR5 AMD Motherboard
SKU: LZ8481868443
Availability: InStock

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Features of GIGABYTE B850M Aorus Elite Wifi6E ICE DDR5 AMD Motherboard

X3D Turbo Mode

Unleash New Era Gaming Performance with One-Click Activation.

X3D Turbo Mode’s unique optimization parameters allow even Ryzen 9000 X3D gaming Performance enhance & Ryzen 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency with GIGABYTE’s BIOS innovation- X3D Turbo Mode.

One-Click Acceleration:

Enhance Gaming FPS Performance with a single clic

Auto CPU & DDR5 Memory Boost

With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.

One-Click Acceleration:

Enhance CPU & DDR5 speeds with a single click.

Real time Analyze
OC accuracy UP
EZ to Pro

Fast AI Performance

Accelerate AI processing for greater performance

Up to

AI Performance*

Accelerated AI decision-making

Boosted reinforcement learning

Streamlined language processing

Boost CPU & Memory Performance

Raise system speed and performance.

Up to

CPU & Memory Performance Boost

Tailored-overclocking for your CPU and memory

Faster data transfer and application loading

Improved multitasking performance

Optimized overall system performance

Maximize performance in a snap

Enable users to easily become overclocking experts through a simple interface.

AI-Driven PCB Technology-Redefining PCB Design with Artificial Intelligence

AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.

AI-ViaFusion Technology

Optimized vias & pads for signal integrity

AI-Trace Technology

Smart routing for peak performance

AI-Layer Technology

Tailored stackups for enhanced functionality

Key Features:
AI-Generated Design Recipes
AI-Driven Simulation
AI-Powered Signal Verification
Single and cross-layer signal optimization

AI-ViaFusion Technology – AI-Powered Excellence in Signal Integrity

Reduction in Signal Reflection Up to28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.

Best-in-class Signal Quality

Superior signal transmission efficiency

Dramatically reduced signal reflection

Elevated signal quality and reliability

Enhanced cross-layer PCB signal performance

AI-ViaFusion Technology – AI-Engineered Via Design Formula

AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.

Optimized Via Design

Varied via sizes for optimized signal and power paths

Driven Pad Optimization

Custom pad sizes for performance and production balance

Precision Impedance Matching

Via & pad sizes selected for optimal signal impedance

Unlock AI-Powered Performance with AI-ViaFusion Technology

Minimized Insertion Loss

Optimized vias reduce signal loss

Enhanced Return Loss

Precision impedance matching reduces reflections

Optimized Eye Diagram

Wider eye opening improves signal integrity

AI-ViaFusion Technology – AI-Driven Revolution in PCB Design

Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.

AI-ViaFusion Technology optimizes PCB performance through:

Strategic Via Sizing

Optimized for varied signals across PCB

Enhanced Impedance Matching

Precise control via machine learning

Space Optimization

Maximized layout efficiency with signal integrity

AI-Trace Technology-Revolutionizing PCB Routing with AI

AI-Trace Technology transforms PCB design by leveraging AI to optimize trace routing, resulting in enhanced performance and signal integrity.

Fiber Weave Effect Mitigation

Optimized signal synchronization

Shielded Memory Routing

Optimized signal shielding and precision

Impedance-Optimized Topology

Refined traces with minimal resistance

Isolated Memory Routing

Optimized trace layout and layer separation

Daisy-Chained Routing

Innovative design eliminates signal bottlenecks

Mitigating Fiber Weave Effect with AI-Trace Technology

Fiber Weave Effect in high-speed PCBs stems from varying dielectric constants of epoxy resin and glass fibers, this causes varying signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace Technology implements innovative routing angles to mitigate this effect.

Benefits of Mitigation:

Reduces signal distortion
Improves transmission reliability
Supports higher data rates
Enhances overall system stability

AI-Layer Technology -Next-Generation Multi-Layer PCB Design

AI-Layer Technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.

Core Innovation:
AI-Optimized Layer Customized Design

AI-optimized layer design
Unique material for each layer
AI-verified signal integrity
Tailored PCB for peak performance

Key Features:
AI-optimized PCB layer and design material
Server-Grade Low Loss PCB*
Enhanced 2X Copper Technology

4Xlarger surface area for enhanced heat dissipation

With up to 4 times the surface area of traditional coolers, this advanced design significantly boosts MOSFET cooling performance

True one-piece heatsink design

Outperforms competitors’ multi-piece solutions
Integrated design and expanded surface area deliver exceptional cooling performance

Multi-cut design with channels for improved airflow

More grooves, more airflow.
Better airflow, cooler system.

SuperiorHeatpipe for optimal heat transfer

Designed for optimal thermal conductivity
Ensures efficient heat transfer and maintains system stability

5 W/mKthermal pad for efficient thermal conductivity

High-performance thermal pad
Keeps your system cool and running at peak efficiency

High Current Support

Supports both PWM and DC fans, plus water cooling pumps
Up to 24W (12V x 2A) capacity per fan header
Built-in over-current protection

Precision Control

Multiple temperature and fan speed points
Customizable fan curves for optimal performance

Dual Curve Mode

Choose between slope and stair modes
Tailor cooling to your specific needs and preferences

Fan Stop Technology

Fans can be completely turned off at low temperatures
Ensures silent operation during light loads

Enhance Fan Curve UI

7 adjustable control points
Expanded speed graph for precise adjustments

Slope/Stair Dual Graph Mode

Slope mode: Smooth fan speed curve
Stair mode: Steady speeds within temperature ranges
Easy switching between modes

Manual Input

Fine-tune fan speeds for optimal performance
Precise control for enthusiasts

EZ Tuning

Quick setup with 4 temperature and fan speed points
Automatic optimization of fan curve

Fan Curve Profile

Save personalized settings to BIOS ROM
Maintain custom settings through BIOS updates

2.5GbE LAN

design deliver blisteringly fast transfer speeds to ensure the most stable transmission environment when the system is performing cloud computing or providing external computing services.

Enhancing VR Experiences with Wi-Fi 6E

Wi-Fi 6E enhances VR with faster speeds, lower latency, increased capacity, and stronger security, enabling seamless wireless streaming of high-quality VR games and improved multi-user experiences.

ower Latency

Lower latency ensures minimal delay between their actions and the corresponding response in online games, resulting in a more responsive and immersive gaming experience.

Higher Speeds

Faster transmission speeds enable quick downloads, seamless online gaming, and smooth video streaming without interruptions.

Increased Capacity

Wi-Fi 6E’s increased capacity ensures smoother gameplay by minimizing congestion and maintaining consistent performance.

Broader spectrum

Wi-Fi 6E’s use of the 6 GHz frequency band provides additional bandwidth, reducing congestion and interference from other devices.

Directional Ultra-high Gain Antenna

Boost your signal strength with GIGABYTE’s Ultra-high gain Antenna, featuring smart antenna technology for optimized Wi-Fi signal transmission.

Specifications of GIGABYTE B850M Aorus Elite Wifi6E ICE DDR5 AMD Motherboard

Model No	B850M-A-ELT-WF6E-ICE
CPU	AMD Socket AM5, support for: AMD Ryzen 9000 Series Processors/ AMD Ryzen 8000 Series Processors/ AMD Ryzen 7000 Series Processors (Go to GIGABYTE’s website for the latest CPU support list.)
Chipset	AMD B850
Memory	Support for DDR5 8200(O.C) / 8000(O.C) / 7950(O.C) / 7900(O.C) / 7800(O.C) / 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C) / 6200(O.C) / 6000(O.C) / 5800(O.C) / 5600(O.C) / 5200 / 4800 / 4400 MT/s memory modules. 4 x DDR5 DIMM sockets supporting up to 256 GB (64 GB single DIMM capacity) of system memory Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO) and Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” on GIGABYTE’s website for more information.)
Onboard Graphics	Integrated Graphics Processor with AMD Radeon Graphics support: – 1 x DisplayPort, supporting a maximum resolution of 3840×2160@144 Hz * Support for DisplayPort 1.4 version and HDR. – 1 x Front HDMI port, supporting a maximum resolution of 1920×1080@30 Hz * Support for HDMI 1.4 version (Graphics specifications may vary depending on CPU support.)”
Audio	Realtek Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. Support for S/PDIF Out
LAN	Realtek 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Wireless Communication module	Realtek Wi-Fi 6E RTL8852CE – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3 – Support for 11ax 160MHz wireless standard (Actual data rate may vary depending on environment and equipment.)
Expansion Slots	1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x16 mode AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode * The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot. Chipset: – 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4)
Storage Interface	1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 25110/22110/2580/2280 SSDs: AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs 1 x M.2 connector (M2B_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs: AMD Ryzen 9000/7000 Series Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x2 SSDs 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices * RAID 5 is only available on AMD Ryzen 9000 Series Processors. RAID 0, RAID 1, and RAID 10 support for SATA storage devices
USB	CPU: – 1 x USB Type-C port on the back panel, with USB 3.2 Gen 2 support – 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel CPU+USB 2.0 Hub: – 4 x USB 2.0/1.1 ports on the back panel Chipset+USB 3.2 Gen 1 Hub: – 4 x USB 3.2 Gen 1 ports on the back panel Chipset: – 1 x USB Type-C port with USB 3.2 Gen 2×2 support, available through the internal USB header – 3 x USB 3.2 Gen 1 ports (1 port on the back panel, 2 ports available through the internal USB header) – 4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors	1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x CPU fan/water cooling pump header 3 x system fan headers 1 x system fan/water cooling pump header 3 x addressable RGB Gen2 LED strip headers 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 2×2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only) 1 x HDMI port (Note) 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper (Note) Actual support may vary by CPU.
Back Panel Connectors	1 x DisplayPort (Note) 1 x Q-Flash Plus button 4 x USB 2.0/1.1 ports 5 x USB 3.2 Gen 1 ports 2 x USB 3.2 Gen 2 Type-A ports (red) 1 x USB Type-C port, with USB 3.2 Gen 2 support 1 x RJ-45 port 2 x antenna connectors (2T2R) 2 x audio jacks 1 x optical S/PDIF Out connector (Note) Actual support may vary by CPU.
I/O Controller	iTE I/O Controller Chip
H/W Monitoring	Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Fan fail warning Fan speed control
BIOS	1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features	Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus Support for Smart Backup
Operating System	Support for Windows 11 64-bit Support for Windows 10 64-bit
Form Factor	Micro ATX Form Factor; 24.4cm x 24.4cm

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GIGABYTE B850M Aorus Elite Wifi6E ICE DDR5 AMD Motherboard